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May 26, 2017 - David Burford brings you some of the week's top stories from around the electronics manufacturing industry including SMT HYBRID highlight, Cleaning and contamination Conference in Amsterdam, Nokia and Apple settle patent dispute plus more. Sponsored by TWIN International.

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Six Sigma:
It is the approach that matters

The Influence of Ionic Contamination

Void Reduction:
A Methodical and Reliable Approach

Choosing the Correct Flux –
Types and Their Advantages / Disadvantages?

Interview Inside:
Bernhard Mürkens

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Global SMT & Packaging is the world’s leading B2B magazine for electronics manufacturing and advanced packaging professionals with editions in Europe, US, China and Southeast Asia. With three editions (InternationalChina and Southeast Asia) and five websites (InternationalChinaSoutheast AsiaGermanyAustriaSwitzerlandUK and Ireland). The magazines, websites and newsletters offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.

Global SMT & Packaging magazine covers all industry sectors involved in electronics assembly such as Aerospace, Telecommunications, Consumer, Industrial, Military, Medical and reports on the latest emerging technologies such as wearables, renewable energy, LEDs and OLEDs. In addition, each issue focuses on the latest manufacturing systems, processes and techniques, including Industry 4.0, Factory 1.0 (China) and other IoM (Internet of Manufacturing) technologies.

Global SMT & Packaging Magazine, Global SMT & Packaging—China and Global SMT & Packaging—Southeast Asia and their associated websites and newsletters are published by Trafalgar Publications, Ltd.