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Get Your X-Ray
Out of the Closet, or at
Least Out of the Lab!
The Evolution of
Getting the Gold Out:
A Critical Requirement for
Track Trace Control:
The Enabling Technology for IoM
John Dulchinos, Jabil Circuit, Inc.
Global SMT & Packaging is the world’s leading B2B magazine for electronics manufacturing and advanced packaging professionals with editions in Europe, US, China and Southeast Asia. With three editions (International, China and Southeast Asia) and five websites (International; China; Southeast Asia; Germany, Austria, Switzerland; UK and Ireland). The magazines, websites and newsletters offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.
Global SMT & Packaging magazine covers all industry sectors involved in electronics assembly such as Aerospace, Telecommunications, Consumer, Industrial, Military, Medical and reports on the latest emerging technologies such as wearables, renewable energy, LEDs and OLEDs. In addition, each issue focuses on the latest manufacturing systems, processes and techniques, including Industry 4.0, Factory 1.0 (China) and other IoM (Internet of Manufacturing) technologies.
Global SMT & Packaging Magazine, Global SMT & Packaging—China and Global SMT & Packaging—Southeast Asia and their associated websites and newsletters are published by Trafalgar Publications, Ltd.