April 21, 2017 - David Burford brings you some of the week's top stories from around the electronics manufacturing industry. Including: Apple has settled a patent dispute; Mycronic has released it’s first quarter 2017 results; DELO have also published financial results for the fiscal year; IPC has been committed to better serving the industry plus more. Sponsored by TWIN International.
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Global SMT & Packaging is the world’s leading B2B magazine for electronics manufacturing and advanced packaging professionals with editions in Europe, US, China and Southeast Asia. With three editions (International, China and Southeast Asia) and five websites (International; China; Southeast Asia; Germany, Austria, Switzerland; UK and Ireland). The magazines, websites and newsletters offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.
Global SMT & Packaging magazine covers all industry sectors involved in electronics assembly such as Aerospace, Telecommunications, Consumer, Industrial, Military, Medical and reports on the latest emerging technologies such as wearables, renewable energy, LEDs and OLEDs. In addition, each issue focuses on the latest manufacturing systems, processes and techniques, including Industry 4.0, Factory 1.0 (China) and other IoM (Internet of Manufacturing) technologies.
Global SMT & Packaging Magazine, Global SMT & Packaging—China and Global SMT & Packaging—Southeast Asia and their associated websites and newsletters are published by Trafalgar Publications, Ltd.