The 3D packaging relates to integration of 3D schemes which is depended on traditional methods of interconnection with flip chip and wire bonding for vertical stacks. Memory die are stacked and are interconnected with package on package (PoP) configurations which are interconnected with wire bonds and interconnected wire bonds.
Flip chips are referred to 3D system in package (SiP) which have mainstream manufacturing with established infrastructure. The package on package method is applied to have vertical integration different technologies like 3D WLP, which uses wafer level processes like for instance water bumping processes to form interconnects and RDL (redistribution layers).
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The 2.5 D interposer could also be considered a 3 D WLP which is capable of interconnecting with die side-side on silicon organic or glass interposer using RDL and TSVs. In most type of 3 D packaging, the chips in the packaging are mounted in a way as a separate package on a normal circuit board which is communicated with the usage of a off chip signaling.
Some of the factors driving the 3 D packaging market include rise in application of portable electronic devices, technological support on 2 D packaging technology and significant growth in demand for miniaturize circuit in microelectronic devices. Thermal complexities with devices and high rate of initial investment which is required in setting up a 3 D packaging plant are some of the challenges faced by the 3 D packaging manufacturers. Growing trend of internet of things is a key opportunity for the 3 D packaging market over the next few years.
The 3 D packaging market by technology has been segmented into 3 D Through SILICON VIA (TSV), 3 D Package on Package (PoP), 3 D Fan Out, 3D Wire Bonded and Other (Flip Chip and Hybrid). The 3 D wire bonded segment in the 3 D packaging market segmented by technology dominated the market in 2016.
The widespread application of flash memory is driving the 3 D wire bonded segment. This is a traditional method and has high market penetration. Moreover, the widespread application of flash memory in consumer electrics, industrial robotics and smart phones is fueling the expansion of 3 D wire bond package segment.
The 3 D packaging market by material could be further segmented into organic substrate, bonding wire, lead frame, encapsulation resin, ceramic package, die attach material and others. The organic substrate segment in the 3 D packaging market segmented by material led the market in 2016.
The 3 D packaging market by industry could be segmented into electronics, industrial, telecommunication, healthcare, automotive & transport, aerospace, defense and others. Geographically the 3 D packaging market could be segmented into North America, Asia Pacific, Middle East and Africa, Europe and Latin America.
Asia Pacific led the 3 D packaging market in 2016 and is also expected to grow at the fastest rate over the next few years. Asia Pacific is followed by North America and Europe. Most of the major players in the semi conductor industry have manufacturing facility in the region and this is driving the demand for 3 D packaging in Asia Pacific and this accounting for the largest market share.
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Some of the key payers operating in the 3 D packaging market include Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. LTD., International Business Machine Corporation (IBM), Qualcomm Technology Inc., Intel Corporation, Taiwan Semiconductor Manufacturing Company Ltd., Stmicroelectronics N.V., Siliconware Precision Industries Co., Ltd (SPIL), Suss Microtec AG. and ASE Group among others.
The key players in the 3 D packaging market have adopted various strategies to expand their business process. Product development and research and development is a key strategy adopted by the players to expand their business in the market.
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