Articles & Papers

By Al Wright, PCB Field Applications Engineer – Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry understand that PCB’s […]

Jun 20, 2018 Package Thermal Challenges Due to Changing Mobile System Form Factors This white paper investigates the historical evolution of mobile platforms […]

Good PCB project engineers are always looking for ways to cut PCB assembly cost and keep it on budget. But most people are […]

The Customer:  A leading small satellite company, delivering operational space missions for a range of applications including Earth observation, science, and communications. The […]

Miniaturization thanks to controlled laser soldering  Packing densities increase on ever smaller electronic assemblies due to technical requirements and possibilities. Accordingly, the [...]

CUSTER AND CUSTER BY WALT CUSTER AND JONATHAN CUSTER Business conditions have continued to improve throughout 2017. The global Purchasing Managers Index (Chart 1) […]

BY INTERFLUX ELECTRONICS NV – TECHNICAL DEPARTMENT Void formation under components with large soldering planes and low stand-off heights, such as QFN components, […]

BY DR. JÖRG SCHAMBACH, INDUSTRIAL IMAGE PROCESSING PRODUCT MANAGER AND MATTHIAS MÜLLER, PUBLIC RELATIONS MANAGER—GÖPEL ELECTRONIC GMBH ■ Equipment being test with camera […]

BY CLAUDE BERGERON, PRODUCT LINE MANAGER, NORDSON EFD Micro-dispensing has evolved to support the needs for higher throughput assembly production by developing specialized […]

Risk is the ‘Effect of Uncertainty on an Expected Result’  JASON BOYD, KULICKE & SOFA N.V. AND MIKE CUMMINGS, TSI CONSULTANTS. The ISO […]