CASE STUDY
El Camino Technologies has focused on the Indian market for more than three
decades. Through this article, we would like to highlight the different stages of
Semiconductor device manufacturing and solutions we offer for production, R&D,
and prototype development as an introduction to the company.
Front End- Wafer Fabrication Solution
Wafer Fabrication:
The Czochralski technique, named after Polish scientist Jan Czochralski, is used to
develop silicon wafers into cylindrical ingots of various diameters. These ingots are
then sliced into wafers and polished to achieve a smooth even surface, which are
ready for fabrication.
El Camino Technologies provides manufacturing solutions for the numerous
processing steps involved in wafer fabrication, which include deposition, removal,
patterning, and electrical property modification. The company offers front end
equipment for different processes, such as wet process tools, Diffusion, Doping,
PECVD, LPCVD, Photolithography, Plasma, Annealing, coating, etching, developing,
thin film metallisation, Metal Lift-off, baking station, and resist coat and bake
systems, among others, with our partners who are world-class leaders in High end
Technologies.
Back End- Assembly and Testing
Assembly and Packaging involves mounting the die, connecting the die pads to the
pins on the package, and sealing the die. Wires are used then to link the pads to the
pins, completing the connection. These wires are gold or aluminium.
El Camino Technologies also offers complete turnkey line solution for assembly and
testing, Island of automation or individual equipment. We provide both automated,
semi-automatic, and manual microelectronic assembly equipment, with a focus on
precision die attach, wire bonding, and batch and auto reflow vacuum systems, in
collaboration with our international partners from the United States, Europe, and
SGP. Wafer dicing, dispensing, bonding, encapsulation, Trim & form, Singulation,
and the integration of whole line systems.
Not only does the firm provide and identifies equipment, but it also offers process
assistance, material guidance, process for discrete and modules (IGBTs, Diodes,
Power MOSFETs), sophisticated packaging solutions for various applications –
Power modules, Micro bolometers, GaN RF power amplifiers, and IR sensors,
automotive, lasers, LEDs, military/high reliability/MEMS, power semiconductors,
RF/microwave/wireless, sensors and telecom/5G/Datacom.
The company also undertakes the project management-Support for Assembly
services, Package Design, and prototype development to manufacturing solutions.
With process/application, expertise and a deep understanding of production needs
we can help in setting up a customized turnkey line.
Characterization equipment
The Metrology or Characterisation is intrinsic part of wafer processing required
between the various processing steps. These wafer test equipment are used to
verify the processing steps up until testing.
El Camino Technologies offers several standard testing solutions for both front and
back end such as sheet resistance both contact and non-contact, hall mobility, thin
film measurement- bow, warp, stress thickness, probe stations, die shear and wire
pull testers, sorters, transfer systems apart from electrical testing of finished device
in tape and reel system.
FA and RA solutions.
We also provide tools for failure analysis and reliability such as – Mechanical, laser
and chemical decap, scanning acoustic, PIND, vibration and BEND testing etc. Help
in establishing required quality management system and documentations &
certifications for the plant.
With our honourable Prime Minister’s recent remarks, we look forward to supporting
his MAKE IN INDIA goal by offering solutions for the production, packaging, and
testing of semiconductor devices in India for a variety of applications.