Upcoming webinar announced: Plan to attend the advanced rigid-flex circuit constructions webinar June 29, 2pm, EST.
New Bedford, Massachusetts – Officials from Epec Engineered Technologies, a leading build to print electronics manufacturer, announced today the acquisition of high reliability custom radio frequency (RF) manufacturer – Putnam RF Filters Inc.
Putnam was founded in 2008 in Manchester, New Hampshire, and was designed to serve the military and aerospace industries. With a focus on manufacturing printed circuits board based RF filters, diplexers, and other custom products.
Epec now offers full design and manufacturing of RF filters which are passive multiport device(s) that allows signals to pass through at discreet frequencies but rejects any frequency outside of a specified range. These devices are typically used in satellite systems, mobile communications, radar systems, medical imaging equipment, remote-sensing systems, and electronic warfare systems.
Passive radio frequency (rf) filters
Ed McMahon, CEO of Epec says, “High reliability custom RF products fit perfectly into our brand promise of providing customers with manufacturing that eliminates risk and improves reliability as Putnam RF Filters is at the leading edge of this technology. With our considerable hi-tech manufacturing investment in both the U.S. and Asia, as well our history as one of the oldest PCB manufacturers in the U.S., we are well positioned to dramatically build this new product offering on the technology and the experience of Putnam RF Filters.”
“Epec has invested in the right equipment and facilities, including their Navy Flight Hardware Certified facility in Largo, FL where all our RF products will now be manufactured. This investment will allow us to offer the highest quality product and much faster development times while maintaining cost effectiveness for our customers,” says Mark Stanley, president of Putnam RF Filters.
“We are very excited about our first acquisition in the RF products space and we look to grow by winning more projects with our key customers along with continuing to look for more acquisitions in this industry,” McMahon adds.
Also announced by company officials is a webinar on June 29, 2017 at 2pm, EST.
The webinar agenda:
- Overview of construction options for rigid and flex areas
- Odd number layer counts for both rigid & flex areas
- Asymmetrical constructions
- Varying flex layer count areas
- Integrated ZIF connections
- Description and benefits of flex layer Air Gap constructions for designs requiring more than 2 flex layers.
- Review of Blind & Buried via constructions with sequential laminations.
- Specific examples of advanced rigid-flex PCB constructions.