YXLON International, a division of the Swiss Comet Group, is launching a brand-new range of X-ray inspection systems dedicated to the Semicon industry. These systems offer advanced automated 2D and 3D inspection of bumps and filled vias to locate, identify and measure failures, including non-wetted bumps, voiding and misalignments to the highest standard. In terms of resolution these systems are among the best on the worldwide market. The range is being introduced during the Semicon China exhibition in Shanghai, March 20-22, 2019, booth #2439 – with a live presentation of the YXLON FF70 CL.
The FF70 CL and FF65 CL series are fully automated analysis systems offering ultra-high resolution and magnification for the smallest semiconductor defect detection. The brand-new range of inspection systems provides automated analysis of TSVs, C4 bumps, 3D packages and MEMS at wafer, strip or component level with maximum throughput. Lastly the FF65 IL with its integrated loader is designed to meet the needs of volume manufacturing whilst maintaining market leading features and benefits. They were developed under collaboration with Nagoya Electric Works.
“Our customers in the Semicon industry require analyzing continuously smaller features at higher speed. Classical electrical testing and optical inspection are coming to their limits, especially in complex 3D packaging”, states Eike Frühbrodt, Vice President YXLON Product and Project Management. “The FF70 CL with its computed laminography for ultra-high volume resolution can handle this challenge easily. An air-suspended high precision manipulator, anti-vibration mechanics and 7 tons of machine weight make it an ideal choice for defect inspection at micron level. And when speed is more an issue than ultra-high resolution, the FF65 CL and FF65 IL will deliver. All three systems are an excellent complimentary range to our existing product portfolio for the Electronics market with Cougar and Cheetah EVO, as well as YXLON FF20 CT and FF35 CT.”
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