Indium Corporation®’s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Shrinking aperture designs have necessitated the use of fine-powder solder paste, with Types 5, 6, and 7 being common—and an identified need for Type 8 in the future. As more components are backed into these advanced designs, solder paste rheology becomes another important characteristic to consider. In Challenge and Solution of Fine Feature Solder Paste Printing for SiP Assembly, Hu will examine common failure modes in SiP assembly and the technological advances in solder paste formulation and substrate design to help eliminate those failure modes. He will also discuss:
- Proper stencil printer setup to reduce assembly defects with designs-of-experiment outlining which stencil printer parameters are statistically significant in improving process yields of SiP assemblies with fine-powder solder pastes
- The importance of solder paste inspection in identifying assembly defects and the important parameters to optimize to accurately inspect solder paste deposits below 90 microns.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has more than 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
About SiP Conference China
From 2017 to 2021, the SiP Conference China attracted more than 200 international and regional companies. The participation of enterprises has truly realized the construction from SiP China to SiP World, realizing the exchange of cutting-edge technology. After years of industry experience, the 6th SiP China Conference will continue to set up two sub-venues in 2022, Shanghai and Shenzhen, aiming to fully radiate the SiP packaging industry clusters in the Yangtze River Delta and the Pearl River Delta. What’s more, it will meet the needs of the booming 5G, AIoT industry chain, and smart wearables, smart phones, smart cars, data centers, and other product lines.