Indium Corporation’s Kenneth Thum, senior technical support engineer, and Nguyen Viet Truong, assistant technical manager for Asia Pacific operations, will present at the upcoming IPC Conferences on Assembly and Reliability in Vietnam and Thailand.
On Jan. 27, Truong will present Thermal Pad Design and Process for Voiding Control at QFN Assembly in Ho Chi Minh City, Vietnam. QFNs are receiving increasing attention in the electronics industry; however, controlling voids is a major challenge due to the large coverage area, large number of vias, and low standoff. This presentation discusses the effect that certain variables have on voiding performance.
Thum will present The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn on Jan. 29 in Bangkok, Thailand. He will discuss SAC0510M, a solder alloy doped
with Mn, and how it can greatly improve thermal fatigue performance and drop-shock resistance. The improvement eliminates the need for underfilling BGAs and CSPs in mobile device assembly.
Truong is responsible for providing technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He is an SMTA-certified process engineer and earned a degree from the Hanoi University of Science and Technology.
Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor’s degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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