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    Industry News Southeast Asia – December 2017

    ■ Koh Young members at recent NEPCON South China 2017.


    Koh Young Technology Highest Sales in History for Q2 2017 

    Koh Young Technology posted its highest quarterly revenue, thanks in part to its growing 3D AOI sales. Koh Young reported revenue of $47.5 million, an increase of 24% on a quarter on quarter basis.

    While its 3D SPI remains as a dominant player in the market, 3D AOI is seen as a core factor for Koh Young’s outstanding achievement in the second quarter. The Zenith 3D AOI series measures true profilometric shape of components, solder joints, patterns, and even identifies foreign material on assembled PCBs, all using True 3D measurement. Because the Zenith offers significant process advantages including lower false calls and higher productivity, it has gained popularity across the global electronics manufacturing industry.


    Galaxy S9 said to use next-gen substrate like PCB technology 

    A recent report suggested that Samsung will not be including under-the-display fingerprint sensor on Galaxy S9 and now another report has claimed that the company will be using SLP (Substrate Like PCB) motherboard on the smartphone to make room for a bigger battery than its predecessor models.

    SLP is essentially a next-generation board with semiconductor package technology and this will be the first time Samsung Electronics is applying SLP to its products, ET News said in its report. Citing industry sources, the report says that Samsung will be using SLP as the main board that that connects major smartphone components such as DRAM, AP (Application Processor), and NAND flash memory.

    “Samsung Electronics started making preparation for production of SLPs with multiple South Korean PCB (Printed Circuit Board) manufacturers such as Samsung Electro-Mechanics Co., Ltd. Corresponding manufacturers are currently bringing in equipment that are needed for production,” Etnews said in its report.


    Kuka wins prestigious Red Dot award for industrial robot 

    Kuka has won a prestigious design award from the Red Dot organisation, which runs a competition which analyses products from an extensive range of industries.

    The award that Kuka won was in the Red Dot industrial product design category, and it was for its industrial robot, the KR CyberTech.

    Kuka says the jury’s reasoning was: “The KR CyberTech industrial robot – with its streamlined, elongated silhouette – stretches the limits of possibility in terms of speed and reach.”

    Kuka says the CyberTech industrial robot is suitable for machining and handling large components as well as for assembly, palletizing and arc welding.

    But mere looks is not generally enough to impress design judges, the product has to perform the functions it was designed to perform, and perform them well, and maybe offer something extra.


    Pickering new LXI ethernet reed relay matrix modules 

    Pickering Interfaces has introduced their new High-Density Modular LXI Ethernet Reed Relay Matrices. The new Modular LXI Matrix Reed Relay Modules (model 65-22x) were originally designed to test Semiconductors at wafer and package levels. The Reed Relay Matrix solution combines Pickering’s LXI Modular Chassis (model 65-200) with their new plug-in matrix module range – providing access to all signal connections on 200 pin connectors. The plug-in modules are constructed using Pickering Electronics’ Reed Relays which offer maximum performance and reliability as well as very fast operate times.

    The range includes four plug-in models covering matrices of up to 1,536×4 in increments of 128 (model 65-221), 768×8 in increments of 64 (model 65-223), 384×16 in increments of 32 (model 65-225), and 192×32 in increments of 32 (model 65-227). Users can specify as many or as few plug-in modules (up to six) required and can field upgrade the chassis to extend the matrix when necessary. Another important feature is that over 1,500 relays can be closed simultaneously for specific conditions for parametric testing.