BRIEF-Tongfu Microelectronics signs IC project worth 7 bln yuan

Tongfu Microelectronics Co Ltd

* Says it signs strategic agreement for integrated circuit project worth 7.0 billion yuan ($1.02 billion) in Xiamen

Source text in Chinese: bit.ly/2rSO9qp

Further company coverage: ($1 = 6.8391 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

 

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