Indium Corporation’s Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on September 28-29 in Singapore.
Lim’s presentation, Challenges of Flip-Chip Die-Attach Using Flux, will include an overview of the different types of flip-chip fluxes, application and reflow process challenges, the cleaning process, and compatibility with capillary or molded underfill.
Microelectronics Tech Asia Singapore Conference is Singapore’s first technical conference and exhibition for the microelectronics design, manufacturing, materials, and equipment industry in Singapore. The event will cover topics relating to device design, IC packaging and assembly, electronics systems design, materials characterization and product prototyping.
Lim manages Indium Corporation’s technical teams throughout the Asia-Pacific region. She has a bachelor’s degree in chemistry from the National University of Singapore and 17 years of experience in the SMT and PCB assembly industries. Lim is an SMTA-certified process engineer and has a Six Sigma Green Belt. She joined Indium Corporation in 2007.