Kulicke & Soffa continues to gain traction with its advanced packaging solutions

Singspore – Kulicke & Soffa Industries (K&S; www.kns.com) continues to expand its presence in the advanced packaging market, through focused feature development and strategic customer engagement.

K&S has a complete offering of advanced packaging solutions supporting Fan-Out Wafer Level Packaging (FOWLP), Wafer Level Packaging (WLP), Flip Chip, System-in-Package (SiP), Package-on-Package (PoP), Embedded Die and Thermo-Compression Bonding (TCB).

Continuing from the first market acceptance of its APAMA™ solutions in February this year, K&S recently received a third purchase order from a global memory manufacturer. In addition, K&S has shipped more than 60 sets of its HYBRID equipment, a multi-application advanced packaging solution, to a major assembly and test provider supporting premium smartphone SIP applications.

Tong Liang Cheam, Kulicke & Soffa’s Vice President of the Advanced Packaging Business Line and Corporate Strategy, commented, “Over the past several years we have aggressively expanded our market presence which now collectively addresses every high-growth advanced packaging process. The recent market successes serve as a testament to our unwavering dedication to support and resolve our customers’ most challenging interconnect requirements.”

K&S continues to further its advanced packaging program through ongoing evaluations, qualifications and its global sampling program with leading integrated device manufacturers and assembly and test providers.


source: http://www.displayplus.net/news/articleView.html?idxno=75305

Contact Us

We're not around right now. But you can send us an email and we'll get back to you, asap.

Not readable? Change text.

Start typing and press Enter to search