Singspore – Kulicke & Soffa Industries (K&S; www.kns.com) continues to expand its presence in the advanced packaging market, through focused feature development and strategic customer engagement.
K&S has a complete offering of advanced packaging solutions supporting Fan-Out Wafer Level Packaging (FOWLP), Wafer Level Packaging (WLP), Flip Chip, System-in-Package (SiP), Package-on-Package (PoP), Embedded Die and Thermo-Compression Bonding (TCB).
Continuing from the first market acceptance of its APAMA™ solutions in February this year, K&S recently received a third purchase order from a global memory manufacturer. In addition, K&S has shipped more than 60 sets of its HYBRID equipment, a multi-application advanced packaging solution, to a major assembly and test provider supporting premium smartphone SIP applications.
Tong Liang Cheam, Kulicke & Soffa’s Vice President of the Advanced Packaging Business Line and Corporate Strategy, commented, “Over the past several years we have aggressively expanded our market presence which now collectively addresses every high-growth advanced packaging process. The recent market successes serve as a testament to our unwavering dedication to support and resolve our customers’ most challenging interconnect requirements.”
K&S continues to further its advanced packaging program through ongoing evaluations, qualifications and its global sampling program with leading integrated device manufacturers and assembly and test providers.