Alpha To Present Technical Papers at SMTA China South Technical Conference in Shenzhen

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Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting two technical papers at SMTA China South Technical Conference on August 30, 2017.

The first technical paper, titled “Comparing the Performance of Engineered Tin-Copper Alloys in Selective Soldering” will be presented by Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions Southern China. This paper details an experiment that compares the hole fill performance of two engineered tin-copper alloys in a selective soldering process. The test vehicle design incorporates features that are optimized for the selective soldering process. Two experiments are performed – one uses no preheat and no inner layer connections at the hole and the second uses preheat and thermally challenging inner layer connections. Engineered tin-copper solder is commonly chosen for use in RoHS-compliant selective soldering applications due to the cost advantage compared to silver-bearing alternatives. The added metals alloyed with eutectic tin-copper provide benefits that can differentiate various alloys in the tin-copper family.

The second paper, titled “Flip Chip LED Assembly by Solder Stamping Pin-Transfer” will be presented by Vincent Liu, LED Application Engineer of Alpha Assembly Solutions in Taiwan. The paper will focus on displaying Alpha products dedicated for flip-chip LED die attach. These fine pitch capable materials (solder, sintered silver and conductive adhesives) have been put through LED packaging processes (like pin transfer / stamping and stencil printing – including 3D stencil, Dispensing etc) at Alpha’s dedicated LED packaging labs. LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications will find this presentation very relevant.

 

SMTA China South Technical Conference
Date: Wednesday, August 30, 2017
Time: 1st Topic: 10:30am -11:05am, 2nd Topic: 14:55pm – 15:30pm
Venue: Booth 1T11, Hall 1, Shenzhen Convention & Exhibition Centre, Shenzhen, China

1st Topic: Comparing the Performance of Engineered Tin-Copper Alloys in Selective Soldering
Presented by: Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions
2nd Topic: Flip Chip LED Assembly by Solder Stamping Pin-Transfer
Presented by: Vincent Liu, LED Application Engineer of Alpha Assembly Solutions

 

Contact
Jackson Chan
Jackson.Chan@AlphaAssembly.com

Vincent Liu
Vincent.Liu@AlphaAssembly.com

Alpha To Present Technical Papers on Comparing Performance of Tin-Copper Alloys and Flip Chip LED at SMTA China South Technical Conference in Shenzhen

Somerset, NJ – August 15, 2017