Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its MVP 850 AOI Platform for at Semicon China 2016
Mchine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850 Platform for Microelectronics and Packaging AOI platform at the Semicon China 2016 exhibition. The exhibition is at the Shanghai New International Expo Center from March 15-17 2016. Machine Vision Products are exhibiting with Teltec Seminconductor at booth #3331.
MVP will be demonstrating a wide range of complex microelectronics inspection applications at Semicon China 2016. These will include leadframe inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities.
The MVP 850 platform is flexible within multiple locations of microelectronics and packaging lines. For Lead Frame processes the MVP 850 can be placed Post Die Bonder, Post Wire Bonder or Post Solder Ball Attach. Within Flip Chip processes the MVP 850 can be positioned Post Wafer Bumping, Post Die Placement, Post Underfill and Post Final Packaging. With resolution and repeatability a critical factor, the 850 platform can be configured to provide a 1um pixel size.
The 850 platform can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. MVP also provide custom handling solutions. In addition the 850 platform can be configured with post processing tools, including physical defect identification/sorting modules, customizable to customer requirements.
The 850 platform includes the MVP 850 DWMS (Die Wire Metrology System) which is configured with MVP’s integrated leadframe magazine loaders. The 850 DWMS is a modular solution providing options for additional ink marking or leadframe puncher capabilities within its review/defect handling stage. Dependent on leadframe density the 850 DWMS is capable of producing UPH of better than 150,000.
For BGA inspection MVP provide the 850 XB option which includes advanced electro-optics and handling solutions. These include 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for in-tray BGA and package inspection. The MVP 850 XB is configured with Jedec Tray handling.
For Metrology based applications MVP offer the 850 XHD. MVP’s 850 XHD provides the highest accuracy flip-chip, Die assembly inspection. Ensuring the correct placement of the Die on the substrate, while providing edge, FM and surface inspection. Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850 XHD can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed Die placement metrology
The MVP 850 platform also integrates MVP’s easy-to-use programming tools and analytical process control tools in this platform. This convergence of technology from Machine Vision Products, Inc. delivers the best available combination of defect detection capabilities, metrology for process control and inspection throughput at a low cost of ownership
MVP continues to lead the global inspection arena by developing all of their product offerings. This provides a much better cost structure to the end user. Additionally, because all development is performed in-house, the support structure is second to none. With over 20 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally. For additional information on this unique solution, please visit us at www.machinevisionproducts.com or visit us at booth #3331 at Semicon China 2016 where we can discuss your application requirements.