Indium Corporation Expert to Present at SiP Conference China

Indium Corporation®’s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China. Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Shrinking aperture designs have necessitated the […]