ASML Developing Next-Gen EUV Lithography
Productivity gains will continue through the next two or three chip generations, but after that we’ll need something bigger and better By Samuel […]
Emerging NVM : PCM finally takes off in stand-alone applications
Extracted from: Emerging Non-Volatile Memory report, Yole Développement OUTLINES: After more than 15 years in development, PCM has finally taken off in stand-alone […]
Renesas Electronics’ Extreme Low-Power SOTB™ Process Technology Eliminates the Need for Batteries to Power IoT Devices
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled an innovative energy-harvesting embedded controller that can eliminate the need [...]
IHP – Innovations for High Performance Microelectronics cooperates with EV Group on low-temperature covalent wafer bonding technologies for developing next-gen communication devices
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP […]
Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded a 2018 Global Technology Award in the category of […]
ZEISS Mineralogic v1.6 offers a bumper range of new capabilities
ZEISS today announces its biggest new release of the ZEISS Mineralogic software at the Process Mineralogy ’18 conference in Cape Town, South Africa. […]
Clamshell Production Test Socket for BGA1089
Socket and Test your 35x35mm BGA device using extreme temperature socket Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high […]
ZEISS and arivis AG intensify strategic partnership
Joint further development of 3D visualizations of multidimensional image data JENA/Germany, MUNICH/Germany ZEISS and arivis have now expanded and deepened their cooperation, which […]
Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies
Finetech, a global supplier of micro-assembly equipment, is pleased to have recently formed a partnership with the Stanford Nanofabrication Facility (SNF) located in […]
EB-350M-7 Lightning-Fast Curing, One Part Epoxy
epoxySet offers the EB-350M-7, a one part, high strength epoxy that can be cured as fast as 1 minute @ 180°C. This high […]
