Southeast Asia EMS and Printed Circuit Boards Assembly News

CEA-Leti Announces Prototype of Next-Generation, Low-Cost Photo-Acoustic Sensors For Gas Detection And Analysis

REDFINCH Team Achieves These Capabilities in Mid-infrared Region, Where Many Important Chemical and Biological Species Have Strong Absorption Fingerprints Leti, a research institute […]

Open Top Spring Pin Socket for 1mm pitch BGA

Socket your BGA361 using Extreme Temperature Socket with Superior Electrical Performance EAGAN, MN – March, 2019 – Ironwood Electronics recently introduced a new […]

Virtual Industries’ ADJUST-A-VAC® Is Ideal Solution for Handling Fragile Components

COLORADO SPRINGS, CO — March 2019 — Virtual Industries Inc., the leading supplier of manual vacuum handling solutions, offers an ADJUST-A-VAC® ESD Safe […]

New Vishay Space-Saving Ultrabright LEDs Produce High Luminous Flux and Intensity

New Yorker Electronics Distributing Vishay Optoelectronics’ LED Ideal for Traffic Signals, Bio Sensing, AV Equipment, LCDs switches and more MARCH 20, 2019 – […]

Expansion of YXLON Product Portfolio for the Semicon Industry

YXLON International, a division of the Swiss Comet Group, is launching a brand-new range of X-ray inspection systems dedicated to the Semicon industry. […]

ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis

New submicron and nanoscale XRM systems and new microCT system provide flexible options for implementing failure analysis to accelerate development and to improve […]

ASML Developing Next-Gen EUV Lithography

Productivity gains will continue through the next two or three chip generations, but after that we’ll need something bigger and better By Samuel […]

Emerging NVM : PCM finally takes off in stand-alone applications

Extracted from: Emerging Non-Volatile Memory report, Yole Développement OUTLINES: After more than 15 years in development, PCM has finally taken off in stand-alone […]

Renesas Electronics’ Extreme Low-Power SOTB™ Process Technology Eliminates the Need for Batteries to Power IoT Devices

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled an innovative energy-harvesting embedded controller that can eliminate the need [...]

IHP – Innovations for High Performance Microelectronics cooperates with EV Group on low-temperature covalent wafer bonding technologies for developing next-gen communication devices

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP […]

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