China’s Tsinghua Unigroup announced on its official website that the group plans to invest CNY260 billion to build a semiconductor industrial base and its new IT investment and R&D headquarters project in Nanjing, Jiangsu province.
Of the total investment, about USD30 billion will be allocated to the semiconductor industrial base, which will mainly produce 3D-NAND flash and DRAM memory chips.
Tsinghua Unigroup said that the first phase of this semiconductor project will have USD10 billion investment and it expects to make 100,000 chips on a monthly basis. The establishment of this project will strongly support China’s development in the mainstream memory sector.
Apart from the chip project, Tsinghua Unigroup will invest about CNY30 billion to build a supporting IC international city, including technology park, design and packaging industrial base, international school, commercial facilities, and international talent apartments.
https://www.chinatechnews.com/2017/01/26/24733-tsinghua-unigroup-to-build-usd30-billion-semiconductor-project-in-nanjing